CIRCUIT AND A METHOD FOR REPAIRING A SEMICONDUCTOR DEVICE CAPABLE OF REPLACING A BAD THROUGH SILICON VIA USING A REPAIRED THROUGH SILICON VIA WITH AN ADJACENT NUMBER

摘要

PURPOSE: A circuit and a method for repairing a semiconductor device is provided to select a signal transmitting path capable of replacing a current bad through silicon via by adjusting the input frequency of a test signal. ;CONSTITUTION: A through silicon via includes normal through silicon vias(B, C, E, F) and repaired through silicon vias(A, D). A transmitting part(200) multiplexes input data according to a controlling signal and transmits the multiplexed input data to the through silicon vias. The transmitting part includes a plurality of multiplexers(210 to 260). A receiving part(300) multiplexes signals from the through silicon vias with a second multiplexing rate and generates output data.;COPYRIGHT KIPO 2011