WAFER CLEANING DEVICE CAPABLE OF ELIMINATING REACTION BY-PRODUCTS WHICH ARE GENERATED DURING DRY-ETCHING WITHOUT HEATING A WAFER AT A HIGH TEMPERATURE AND A WAFER CLEANING METHOD USING THE SAME

摘要

PURPOSE: A wafer cleaning device and a wafer cleaning method using the same are provided to shorten the manufacturing time of a semiconductor device and increase production. ;CONSTITUTION: An oxide film is formed on a wafer(200). The oxide film is eliminated using HF and NH3 during a dry-cleaning process. Chemicals are sprayed onto the wafer to eliminate reaction by-products, which are generated during the dry-etching process, during a wet-cleaning process.;COPYRIGHT KIPO 2011