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COMPOSITION FOR FORMING A SUBSTRATE CAPABLE OF FORMING AN INSULATING MATERIAL OF A PRINTED CIRCUIT BOARD EXHIBITING LOW PERMITTIVITY, AND A PREPREG AND A SUBSTRATE USING THE SAME
COMPOSITION FOR FORMING A SUBSTRATE CAPABLE OF FORMING AN INSULATING MATERIAL OF A PRINTED CIRCUIT BOARD EXHIBITING LOW PERMITTIVITY, AND A PREPREG AND A SUBSTRATE USING THE SAME
PURPOSE: A composition for forming a substrate is provided to ensure excellent thermal and mechanical stability and good electrical characteristics, thereby enabling use high-speed circuits and an insulating material for a printed circuit board of a high frequency band. ;CONSTITUTION: A composition for forming a substrate comprises a matrix resin formed by a fluoroepoxy compound is introduced to the backbone of an epoxy resin. The fluoro epoxy compound is introduced to the main chain of the epoxy resin through curing reaction. The fluoro epoxy compound has a reactive group capable of participating in the curing reaction. The reactive functional group is one or more selected from -COOH, -OH, -NH2 and -Cl.;COPYRIGHT KIPO 2011
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