首页> 外国专利> COMPOSITION FOR FORMING A SUBSTRATE CAPABLE OF FORMING AN INSULATING MATERIAL OF A PRINTED CIRCUIT BOARD EXHIBITING LOW PERMITTIVITY, AND A PREPREG AND A SUBSTRATE USING THE SAME

COMPOSITION FOR FORMING A SUBSTRATE CAPABLE OF FORMING AN INSULATING MATERIAL OF A PRINTED CIRCUIT BOARD EXHIBITING LOW PERMITTIVITY, AND A PREPREG AND A SUBSTRATE USING THE SAME

机译:用于形成基板的组合物,该基板能够形成具有低介电常数的印刷电路板的绝缘材料,以及预浸料和基材的使用相同的材​​料

摘要

PURPOSE: A composition for forming a substrate is provided to ensure excellent thermal and mechanical stability and good electrical characteristics, thereby enabling use high-speed circuits and an insulating material for a printed circuit board of a high frequency band. ;CONSTITUTION: A composition for forming a substrate comprises a matrix resin formed by a fluoroepoxy compound is introduced to the backbone of an epoxy resin. The fluoro epoxy compound is introduced to the main chain of the epoxy resin through curing reaction. The fluoro epoxy compound has a reactive group capable of participating in the curing reaction. The reactive functional group is one or more selected from -COOH, -OH, -NH2 and -Cl.;COPYRIGHT KIPO 2011
机译:目的:提供用于形成基板的组合物以确保优异的热和机械稳定性以及良好的电特性,从而使得能够将高速电路和绝缘材料用于高频带的印刷电路板。 ;组成:用于形成基材的组合物,其包含由氟代环氧化合物形成的基体树脂,该基体树脂被引入到环氧树脂的骨架中。通过固化反应将氟代环氧化合物引入到环氧树脂的主链中。氟环氧化合物具有能够参与固化反应的反应性基团。反应性官能团是选自-COOH,-OH,-NH 2和-Cl中的一个或多个。COPYRIGHTKIPO 2011

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