机译:AlN含量对印刷电路板基材溴化环氧树脂性能的影响
AlN additives; brominated epoxy; coefficient of thermal expansion; dielectric constant; dielectric dissipation factor; dynamic mechanical analysis; glass-transition temperature; halogenated resins; tensile strength; theoretical models; thermal conductivity; Young's modulus; ALUMINUM-NITRIDE COMPOSITES; THERMAL-CONDUCTIVITY; GLASS-TRANSITION; MECHANICAL-PROPERTIES; MOLDING COMPOUNDS; BORON-NITRIDE; BEHAVIOR; NANOCOMPOSITES; FILLER; SIZE;
机译:AlN含量对印刷电路板基材溴化环氧树脂性能的影响
机译:溴化环氧树脂对环境偏重回收铜作为氯化铵电路板铜氧化物纳米粒子的溶解
机译:亚临界乙酸在温和条件下增强了废印刷电路板中溴化环氧树脂的溶胀增强催化降解
机译:废印刷电路板采用离子液体BMIM CL溴化环氧树脂溶解研究
机译:玻璃/环氧界性对印刷电路板电化学故障的影响
机译:印刷电路板衍生的玻璃纤维环氧树脂支持Mo-Cu双金属催化合成葡萄糖
机译:AlN含量对印刷电路板基材溴化环氧树脂性能的影响