COMPOSITION FOR FORMING A SUBSTRATE WITH LOW PERMITTIVITY AND LOW THERMAL EXPANSION PROPERTY, A PREPREG AND A SUBSTRATE USING THE SAME

摘要

PURPOSE: A composition for forming a substrate is provided to enable a printed circuit board insulating material of high speed circuits and high frequency band, to ensure no local difference, and to secure a low dielectric property and low coefficient of thermal expansion.;CONSTITUTION: A composition for forming a substrate comprises (a) a liquid crystal thermosetting oligomer which includes one or more of soluble structures in a backbone and has a thermosetting group in one or more terminals of a main chain, (b) a fluorinated resin powder, and (c) a solvent. In chemical formula 1, Ar is a C4~30 aryl group; and X^1 and Y^1 are selected from the group consisting of COO, O, CONR'', NR''', and CO, wherein R'' and R''' are independently hydrogen, C1~20 alkyl group and C6~30 aryl group and one or more of X^1 and/or Y^1 are CONR'' or NR'''.;COPYRIGHT KIPO 2012