SOCKET FOR SEMICONDUCTOR PACKAGE TEST, A TEST PROBE, AND METHOD OF A SEMICONDUCTOR PACKAGE CAPABLE OF REINFORCING A HARDNESS OF A TEST PROBE END TERMINAL

摘要

PURPOSE: A socket for semiconductor package test, a test probe, and a method of a semiconductor package are provided to safely maintain an initial performance without pollution due to a foreign material for a long time. ;CONSTITUTION: A socket housing(110) is stored in a semiconductor package(10). A test probe is included in lower part of the socket housing and is physically contacted with a semiconductor package. A conductive polymer resin is a part that the test probe and the semiconductor are physically contacted.;COPYRIGHT KIPO 2011