首页> 外国专利> THIN FILM TRANSISTOR, A METHOD FOR FABRICATING A THIN FILM TRANSISTOR AND THE THIN FILM TRANSISTOR BY THEREOF, CAPABLE OF FORMING A SOURCE REGION, DRAIN REGION, AND A CHANNEL REGION THROUGH ONE TIME OF IMPURITY IMPLANTATION

THIN FILM TRANSISTOR, A METHOD FOR FABRICATING A THIN FILM TRANSISTOR AND THE THIN FILM TRANSISTOR BY THEREOF, CAPABLE OF FORMING A SOURCE REGION, DRAIN REGION, AND A CHANNEL REGION THROUGH ONE TIME OF IMPURITY IMPLANTATION

机译:薄膜晶体管,通过其制造薄膜晶体管和薄膜晶体管的方法,能够一次通过杂质注入形成源区,漏区和通道区

摘要

PURPOSE: A thin film transistor, a method for fabricating a thin film transistor and the thin film transistor by thereof are provided to easily the width of a GOLDD(Gate Overlapped Lightly Doped Drain) region by controlling the width of a second gate electrode.;CONSTITUTION: In a thin film transistor, a method for fabricating a thin film transistor and the thin film transistor by thereof, a buffer layer(120) is formed on an insulating substrate(110). A semiconductor layer(130) is formed on the buffer layer. A gate insulating layer(140) is formed on the top side of the semiconductor layer. A first gate electrode(150) is formed in the upper part of the gate insulating layer. A second gate electrode(160) is formed to be contacted to the side wall of the first gate electrode.;COPYRIGHT KIPO 2011
机译:目的:提供一种薄膜晶体管,一种制造薄膜晶体管的方法及其薄膜晶体管,以通过控制第二栅电极的宽度而容易地形成GOLDD(栅极重叠轻掺杂漏极)区域的宽度。构成:在薄膜晶体管的制造方法及其薄膜晶体管中,在绝缘基板(110)上形成缓冲层(120)。在缓冲层上形成半导体层(130)。在半导体层的顶面上形成栅极绝缘层(140)。在栅绝缘层的上部形成第一栅电极(150)。第二栅电极(160)形成为与第一栅电极的侧壁接触。; COPYRIGHT KIPO 2011

著录项

  • 公开/公告号KR20110094837A

    专利类型

  • 公开/公告日2011-08-24

    原文格式PDF

  • 申请/专利权人 SNU R&DB FOUNDATION;

    申请/专利号KR20100014499

  • 发明设计人 KIM SUN JAE;HAN MIN KOO;

    申请日2010-02-18

  • 分类号H01L29/786;G02F1/133;

  • 国家 KR

  • 入库时间 2022-08-21 17:51:13

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