首页> 外国专利> LASER PATTERNING SYSTEM AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME CAPABLE OF SUPPRESSING THERMAL DAMAGE IN A LASER SCRIBING PROCESS

LASER PATTERNING SYSTEM AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME CAPABLE OF SUPPRESSING THERMAL DAMAGE IN A LASER SCRIBING PROCESS

机译:利用在激光刻划过程中能够抑制热损伤的相同能力制造半导体装置的激光刻划系统和方法

摘要

PURPOSE: A laser patterning system and a method for manufacturing a semiconductor device using the same are provided to remove residues in a pattern process by interlocking a laser scribing device with a residue removing device.;CONSTITUTION: A process chamber(10) forms a sealed space for the pattern process of a semiconductor device. A laser scribing device(20) patterns a thin film(200) formed on one side of a substrate(100). The laser scribing device includes a first moving unit(21), a laser generating unit(22), and a laser radiating unit(23). A residue removing device(30) removes the residues generated in a thin film patterning process and includes a second moving unit(31) and a residue removing unit(32).;COPYRIGHT KIPO 2012
机译:目的:提供一种激光图案化系统和使用该图案的制造半导体器件的方法,以通过将激光划片装置与残余物去除装置互锁来去除图案化过程中的残余物。组成:处理室(10)形成密封用于半导体器件的图案处理的空间。激光划片装置(20)对形成在基板(100)的一侧上的薄膜(200)进行图案化。该激光刻划装置包括第一移动单元(21),激光产生单元(22)和激光辐射单元(23)。残留物去除装置(30)去除在薄膜图案形成过程中产生的残留物,并且包括第二移动单元(31)和残留物去除单元(32)。; COPYRIGHT KIPO 2012

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