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SUBSTRATE SUPPORTING APPARATUS, SUBSTRATE SUPPORTING METHOD, SEMICONDUCTOR MANUFACTURING APPARATUS AND STORAGE MEDIUM

机译:基板支撑装置,基板支撑方法,半导体制造装置和存储介质

摘要

A substrate supporting apparatus includes a substrate supporting portion having a substrate supporting surface facing a rear surface of a substrate; plural protruding portions provided on the substrate supporting surface, for preventing the substrate from being slid on the substrate supporting surface by friction force generated in relation with the substrate; a gas discharge opening provided in the substrate supporting surface, for discharging gas toward the rear surface of the substrate; a gas flow path whose one end is connected to the gas discharge opening; and a temperature control unit for controlling temperature of the gas flowing through the gas flow path, wherein the gas discharged to the rear surface of the substrate flows in a gap between the substrate supporting surface and the substrate, and by Bernoulli effect causing reduction of pressure of the gap, the substrate is attracted to the substrate supporting portion, thereby supporting the substrate.
机译:基板支撑装置包括:基板支撑部,其具有与基板的背面相对的基板支撑面;和多个突出部设置在基板支撑面上,用于防止基板因相对于基板产生的摩擦力在基板支撑面上滑动。气体排放口设置在基板支撑表面中,用于向基板的后表面排放气体;气体流路,其一端连接到排气口。以及温度控制单元,其用于控制​​在气体流路中流动的气体的温度,其中,排出到基板的背面的气体在基板支撑面与基板之间的间隙中流动,并通过伯努利效应使压力降低。在间隙的一半处,基板被吸引到基板支撑部,从而支撑基板。

著录项

  • 公开/公告号KR101015190B1

    专利类型

  • 公开/公告日2011-02-17

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20080079220

  • 发明设计人 콘도 케이스케;

    申请日2008-08-13

  • 分类号H01L21/02;H01L21/677;

  • 国家 KR

  • 入库时间 2022-08-21 17:50:35

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