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stacking fault nucleation place continuously reducing the lithography method and reduced stacking fault nucleation place, including those which structures

机译:堆垛层错形核位置不断减少的光刻方法,减少了堆垛层错形核位置,包括那些

摘要

off-axis with respect to the crystallographic orientation (off-axis) of the surface shape of the silicon carbide substrate having a bearing formed to produce the epitaxial silicon carbide layer . The shapes are non-parallel (that is , inclined or vertical ) to the crystallographic direction in the bearing that comprises at least one of the side walls . Then, the epitaxial silicon carbide layer is grown on the surface of the silicon carbide substrate comprising the shape . Then , the second shape are grown on the first epitaxial layer . The second shape include a minimum of one side wall that is antiparallel orientation with respect to the crystallographic orientation . A second epitaxial silicon carbide layer is grown on the surface of the first epitaxial silicon carbide layer comprising the second shape .
机译:相对于具有形成以形成外延碳化硅层的轴承的碳化硅衬底的表面形状的晶体学取向(偏轴)的偏轴。形状与包括至少一个侧壁的轴承中的晶体学方向不平行(即倾斜或垂直)。然后,在包括该形状的碳化硅衬底的表面上生长外延碳化硅层。然后,在第一外延层上生长第二形状。第二形状包括相对于晶体学取向反平行取向的最小值的一个侧壁。在包括第二形状的第一外延碳化硅层的表面上生长第二外延碳化硅层。

著录项

  • 公开/公告号KR1010745980000B1

    专利类型

  • 公开/公告日2011-10-17

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR1020067019094

  • 申请日2005-02-14

  • 分类号H01L21/20;H01L21/04;H01L21/027;

  • 国家 KR

  • 入库时间 2022-08-21 17:49:37

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