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stacking fault nucleation place continuously reducing the lithography method and reduced stacking fault nucleation place, including those which structures
stacking fault nucleation place continuously reducing the lithography method and reduced stacking fault nucleation place, including those which structures
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机译:堆垛层错形核位置不断减少的光刻方法,减少了堆垛层错形核位置,包括那些
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摘要
off-axis with respect to the crystallographic orientation (off-axis) of the surface shape of the silicon carbide substrate having a bearing formed to produce the epitaxial silicon carbide layer . The shapes are non-parallel (that is , inclined or vertical ) to the crystallographic direction in the bearing that comprises at least one of the side walls . Then, the epitaxial silicon carbide layer is grown on the surface of the silicon carbide substrate comprising the shape . Then , the second shape are grown on the first epitaxial layer . The second shape include a minimum of one side wall that is antiparallel orientation with respect to the crystallographic orientation . A second epitaxial silicon carbide layer is grown on the surface of the first epitaxial silicon carbide layer comprising the second shape .
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