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A semiconductor device constructed in a crystalline substrate material and having an embedded in-situ doped semiconductor material

机译:一种由晶体衬底材料构成并具有嵌入式原位掺杂半导体材料的半导体器件

摘要

The pn junction of a substrate diode in a complex SOI device is fabricated on the basis of an embedded in-situ doped semiconductor material, thereby achieving better diode characteristics. For example, a silicon / germanium semiconductor material is fabricated in a recess in the substrate material, the size and shape of the recess being selected to avoid undesirable interaction with metal silicide material.
机译:在复杂的SOI器件中,衬底二极管的pn结是基于嵌入的原位掺杂半导体材料制造的,从而实现了更好的二极管特性。例如,在衬底材料的凹部中制造硅/锗半导体材料,选择凹部的尺寸和形状以避免与金属硅化物材料发生不期望的相互作用。

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