首页> 外国专利> Electromechanical microstructure for e.g. acceleration sensor, has movable elements connected with substrate and with area made of partially monocrystalline silicon, and spring with area made of partially polycrystalline silicon

Electromechanical microstructure for e.g. acceleration sensor, has movable elements connected with substrate and with area made of partially monocrystalline silicon, and spring with area made of partially polycrystalline silicon

机译:机电微观结构加速度传感器,具有与基板连接的可移动元件,其区域由部分单晶硅制成,弹簧具有区域,该区域由部分多晶硅制成

摘要

The microstructure (100) has movable elements connected with a substrate e.g. silicon wafer, by a spring. The movable elements have an area made of partially polycrystalline silicon, and the spring has an area (120) made of partially monocrystalline silicon. The movable elements have an area made of partially monocrystalline silicon, and the spring has another area made of partially polycrystalline silicon. The movable elements are connected with spring suspensions by the spring. The spring suspensions have an area (130) made of partially monocrystalline silicon. An independent claim is also included for a method for manufacturing an electromechanical microstructure.
机译:所述微结构(100)具有与衬底(例如衬底)连接的可移动元件。硅片,通过弹簧。可移动元件具有由部分多晶硅制成的区域,并且弹簧具有由部分单晶硅制成的区域(120)。可移动元件具有由部分单晶硅制成的区域,并且弹簧具有由部分多晶硅制成的另一区域。可动元件通过弹簧与弹簧悬架连接。弹簧悬架具有由部分单晶硅制成的区域(130)。还包括用于制造机电微结构的方法的独立权利要求。

著录项

  • 公开/公告号DE102009026639A1

    专利类型

  • 公开/公告日2010-12-09

    原文格式PDF

  • 申请/专利权人 ROBERT BOSCH GMBH;

    申请/专利号DE20091026639

  • 发明设计人 REINMUTH JOCHEN;BUTZ JUERGEN;WILL BARBARA;

    申请日2009-06-02

  • 分类号B81B7/02;B81B3;B81C1;

  • 国家 DE

  • 入库时间 2022-08-21 17:47:52

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号