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Electromechanical microstructure for e.g. acceleration sensor, has movable elements connected with substrate and with area made of partially monocrystalline silicon, and spring with area made of partially polycrystalline silicon
Electromechanical microstructure for e.g. acceleration sensor, has movable elements connected with substrate and with area made of partially monocrystalline silicon, and spring with area made of partially polycrystalline silicon
The microstructure (100) has movable elements connected with a substrate e.g. silicon wafer, by a spring. The movable elements have an area made of partially polycrystalline silicon, and the spring has an area (120) made of partially monocrystalline silicon. The movable elements have an area made of partially monocrystalline silicon, and the spring has another area made of partially polycrystalline silicon. The movable elements are connected with spring suspensions by the spring. The spring suspensions have an area (130) made of partially monocrystalline silicon. An independent claim is also included for a method for manufacturing an electromechanical microstructure.
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