A method for the production of a plurality of thin chips and correspondingly, made of thin chip

摘要

There are measures for producing of by means of contacts, in a thin chips proposed, the functionality, starting from the surface layer of a semiconductor substrate (1) in a layer structure (2) is realized. For the separation of these chips, the surface layer with the layer structure (2) are structured and it is at least one hollow space (3) under the surface layer is generated, so that the individual chips (10) by into the cavity (3) which open into the trenches (9) are defined and the individual chips (10) on support elements (4) in the region of the hollow space (3) with the substrate (1) below the cavity (3) are connected.The chips (10) are provided by means of contacts (50), in that first of all for each through contact (50) a contact hole (5) is generated, which extends through the entire layer structure (2) of the chip (10) and extends into a support element (4) opens. Thereafter, at least one dielectric layer (7) on the so structured layer structure (2) and in particular to the wall of the contact holes (5) to be produced and applied in accordance with the electrical connections between areas of the chip surface and at least one through contact (50) is structured. Thereafter, a metallization layer (8) are applied and structured, which, in particular, on the wall of the contact holes (5) and which is adapted to the contact holes (5) adjacent surface areas of the layered structure (2) extends. Finally, the thus metallized contact holes (5) with a solder ..