Method for manufacturing e.g. application-specific integrated switching circuit, involves removing connector of plastic mass and chips from carrier by thermal decomposition of thermoplastic material at temperature

摘要

The method involves embedding a semiconductor chip (14) into a plastic mass at temperature for forming a connector from the plastic mass and the semiconductor chips, where temperature of a thermoplastic material (12) i.e. polycyclic olefin, is lower or equal to another temperature. A softening of the thermoplastic material is utilized, and the connector of the plastic mass and the semiconductor chips is removed from a carrier (10) by thermal decomposition of the thermoplastic material at the latter temperature that is higher than the former temperature. An independent claim is also included for a connector including a carrier.