首页> 外文期刊>International Journal of High Speed Electronics and Systems (IJHSES) >A UNIVERSAL SOI-BASED HIGH TEMPERATURE GATE DRIVER INTEGRATED CIRCUIT FOR SiC POWER SWITCHES WITH ON-CHIP SHORT CIRCUIT PROTECTION
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A UNIVERSAL SOI-BASED HIGH TEMPERATURE GATE DRIVER INTEGRATED CIRCUIT FOR SiC POWER SWITCHES WITH ON-CHIP SHORT CIRCUIT PROTECTION

机译:具有片上短路保护的SiC功率开关的通用基于SOI的高温门极驱动器集成电路

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摘要

In recent years, increasing demand for hybrid electric vehicles (HEVs) has generated the need fornreliable and low-cost high-temperature electronics which can operate at the high temperatures undernthe hood of these vehicles. A high-voltage and high temperature gate-driver integrated circuit fornSiC FET switches with short circuit protection has been designed and implemented in a 0.8-micronnsilicon-on-insulator (SOI) high-voltage process. The prototype chip has been successfully tested upnto 200ºC ambient temperature without any heat sink or cooling mechanism. This gate-driver chip canndrive SiC power FETs of the DC-DC converters in a HEV, and future chip modifications will allownit to drive the SiC power FETs of the traction drive inverter. The converter modules along with thengate-driver chip will be placed very close to the engine where the temperature can reach up to 175ºC.nSuccessful operation of the chip at this temperature with or without minimal heat sink and withoutnliquid cooling will help achieve greater power-to-volume as well as power-to-weight ratios for thenpower electronics module.
机译:近年来,对混合动力电动汽车(HEV)的需求不断增长,因此产生了对可靠,低成本的高温电子设备的需求,这些电子设备可在这些汽车发动机罩的高温下运行。用于nSiC FET开关的具有短路保护功能的高压高温栅极驱动器集成电路已经在0.8微米绝缘体上硅(SOI)高压工艺中设计和实现。原型芯片已成功在高达200ºC的环境温度下进行了测试,没有任何散热器或冷却机制。该栅极驱动器芯片无法驱动混合动力汽车中的DC-DC转换器的SiC功率FET,未来的芯片改进将允许驱动牵引驱动逆变器的SiC功率FET。转换器模块和然后的门极驱动器芯片将被放置在非常接近发动机的地方,温度可以达到175ºC。n在此温度下,无论是否有最小的散热片以及没有液体冷却的情况下,芯片的成功运行都将有助于获得更大的功率。电力电子模块的体积和功率重量比。

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