首页> 外国专利> Method for thermal destruction of electronic data carrier and/or integrated circuit e.g. processor chip, involves forming metal melt, and partly melting carrier and/or integrated circuit by irreversible destruction of data in carrier

Method for thermal destruction of electronic data carrier and/or integrated circuit e.g. processor chip, involves forming metal melt, and partly melting carrier and/or integrated circuit by irreversible destruction of data in carrier

机译:电子数据载体和/或集成电路的热破坏方法,例如处理器芯片涉及形成金属熔体,并通过不可逆地破坏载体中的数据来部分熔化载体和/或集成电路

摘要

The method involves bringing an electronic data carrier (2) and/or an integrated circuit and a metallic redox mixture (11) into a heatproof container (10), where the redox mixture comprises metal oxide serving as oxidants and metal i.e. elementary aluminum, serving as reducing agents. The redox mixture is ignited for starting an intense exothermic redox reaction. A metal melt is formed as sequence of the redox reaction. The data carrier and/or the integrated circuit are partly melted by irreversible destruction of data stored in the electronic data carrier. The heatproof container is designed as ceramic crucible. An independent claim is also included for a device for thermal destruction of an electronic data carrier and/or an integrated circuit.
机译:该方法包括将电子数据载体(2)和/或集成电路和金属氧化还原混合物(11)放入耐热容器(10)中,其中氧化还原混合物包括用作氧化剂的金属氧化物和用作元素的金属,即元素铝。作为还原剂。点燃氧化还原混合物以开始强烈的放热氧化还原反应。按照氧化还原反应的顺序形成金属熔体。数据载体和/或集成电路由于电子数据载体中存储的数据的不可逆破坏而部分熔化。耐热容器设计为陶瓷坩埚。还包括用于热破坏电子数据载体和/或集成电路的设备的独立权利要求。

著录项

  • 公开/公告号DE102012004455A1

    专利类型

  • 公开/公告日2013-09-12

    原文格式PDF

  • 申请/专利权人 ERMKE ANDREAS;RUCK HELMUT;

    申请/专利号DE20121004455

  • 发明设计人 ERMKE ANDREAS;RUCK HELMUT;

    申请日2012-03-08

  • 分类号F23G7/00;

  • 国家 DE

  • 入库时间 2022-08-21 16:21:59

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