Brief description of the closing of the cavity for at least one device microelectronics

摘要

Method of the closing of at least one cavity intended to be encapsulated or form part of a microelectronic device (100, 102, 104), comprising the following steps: a) production of a cavity (118) in a first substrate comprising a first layer (116) traversed by an opening (120) forming an access to the cavity, b) production of a portion of the material of the hooks (122) around the opening, on one face of the first layer is located on the opposite side to the cavity, c) production, on a second substrate (202), of a portion of a meltable material (210), d) is placed in contact with the portion of the fusible material with the portion of the material of the hooks, e) forming a plug (212) of the opening, adhering to the portion of material to be attached by a melting and solidification of the fusible material, f) separation of the plug and the second substrate.