DEVICE AND METHOD FOR REMOVING ANNULAR CONVEX PORTION

摘要

PROBLEM TO BE SOLVED: To provide a device and a method for removing an annular convex portion, capable of removing the annular convex portion without damaging a wafer.;SOLUTION: The annular convex portion removal device is provided for removing the annular convex portion from a wafer unit which includes: the wafer having a circular concave portion and the annular convex portion surrounding the concave portion, and having a segmentation groove formed on a boundary portion between the circular concave portion and the annular convex portion; an adhesive tape; and an annular frame attached to the outer circumference portion of the adhesive tape. The annular convex portion removal device includes: a chuck table 26, having a retention surface 82 with a slightly smaller diameter than the circular concave portion, for sucking the circular concave portion; a frame fixation portion 30 for fixing the annular frame; a second retention surface 82 having a suction unit 84 for sucking to hold the adhesive tape between the outer circumference of the wafer and the inner circumference of the annular frame of the wafer unit; an annular convex portion supporter 80, protruding from the second retention surface 82, for supporting the inner circumference of the annular convex portion; and further, an outer table 27 disposed on the outer circumference side of the chuck table 26.;COPYRIGHT: (C)2012,JPO&INPIT