首页> 外国专利> CARBON FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND METHOD OF MANUFACTURING CARBON FIBER-REINFORCED COMPOSITE MATERIAL

CARBON FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND METHOD OF MANUFACTURING CARBON FIBER-REINFORCED COMPOSITE MATERIAL

机译:碳纤维增强复合材料,预浸料和制造碳纤维增强复合材料的方法

摘要

PROBLEM TO BE SOLVED: To provide a prepreg that can form an carbon fiber-reinforced composite material excellent in interlayer toughness and the conductivity of a Z-axis direction.;SOLUTION: The carbon fiber-reinforced composite material includes: a resin layer including: a resin particle containing a matrix resin and a polyamide resin having a structure shown by formula (1); and a conductive particle whose average particle diameter is larger than that of the resin particle; and carbon fiber layers provided on both principal planes of the resin layer and containing a carbon fiber, wherein the difference between the average thickness of the resin layer and the average particle diameter of the resin particle including the polyamide resin having the structure shown by the following formula (1) is at most 12 μm. In the formula, a and b denote an integer of 0-4, R1 and R2 each independently denote an alkyl group or a halogen atom, and R3 denotes an alkanediyl group, a cycloalkanediyl group or an alkenediyl group.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种预浸料,其可以形成层间韧性和Z轴方向的导电性优良的碳纤维增强复合材料。解决方案:碳纤维增强复合材料包括:树脂层,包括:包含具有式(1)所示的结构的基质树脂和聚酰胺树脂的树脂颗粒;导电粒子的平均粒径大于树脂粒子的平均粒径。设置在树脂层的两个主面上且包含碳纤维的碳纤维层,其中,树脂层的平均厚度与包含具有以下所示的结构的聚酰胺树脂的树脂颗粒的平均粒径之差。式(1)最大为12μm。式中,a和b表示0〜4的整数,R 1 和R 2 分别独立地表示烷基或卤素原子,R 3 表示烷二基,环烷二基或烯二基。;版权:(C)2013,日本特许厅&INPIT

著录项

  • 公开/公告号JP2012211310A

    专利类型

  • 公开/公告日2012-11-01

    原文格式PDF

  • 申请/专利权人 TORAY IND INC;

    申请/专利号JP20120058399

  • 申请日2012-03-15

  • 分类号C08J5/04;C08J5/24;C08L101/00;C08L77/00;C08K7/06;C08K7/16;

  • 国家 JP

  • 入库时间 2022-08-21 17:44:14

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