METHOD OF MANUFACTURING SEMICONDUCTOR MODULE TO WHICH HIGHLY HEAT CONDUCTIVE ADHESIVE SHEET WITH METAL FOIL OR HIGHLY HEAT CONDUCTIVE ADHESIVE SHEET WITH METAL PLATE IS ADHERED

摘要

PROBLEM TO BE SOLVED: To provide a resin composition having suppressed progress of a curing reaction, to provide a heat conductive sheet and a highly heat conductive adhesive sheet with a metal foil having excellent heat conductivity, heat resistance etc., and good adhesion work efficiency and to provide a highly heat conductive adhesive sheet with a metal plate, etc.;SOLUTION: The resin composition contains an epoxy resin and an inorganic filler and further contains a curing accelerator so as to heat-cure the epoxy resin. In the resin composition, an inorganic filler containing a boron trioxide component is used as the inorganic filler. One or more kinds selected from the group consisting of a secondary amine-based curing accelerator, a tertiary amine-based curing accelerator and an imidazole-based curing accelerator are used as the curing accelerator.;COPYRIGHT: (C)2012,JPO&INPIT