首页> 外国专利> POLYMER COMPOSITION, THERMALLY-CONDUCTIVE SHEET, HIGHLY THERMALLY-CONDUCTIVE ADHESIVE SHEET WITH METAL FOIL, HIGHLY THERMALLY-CONDUCTIVE ADHESIVE SHEET WITH METAL PLATE, METAL-BASED CIRCUIT BOARD AND POWER MODULE

POLYMER COMPOSITION, THERMALLY-CONDUCTIVE SHEET, HIGHLY THERMALLY-CONDUCTIVE ADHESIVE SHEET WITH METAL FOIL, HIGHLY THERMALLY-CONDUCTIVE ADHESIVE SHEET WITH METAL PLATE, METAL-BASED CIRCUIT BOARD AND POWER MODULE

机译:聚合物成分,导热板,带金属箔的高导热胶板,带金属板,金属基电路板和电源模块的高导热胶板

摘要

PPROBLEM TO BE SOLVED: To provide a polymer composition capable of improving thermal conductivity of molded articles, a thermally-conductive sheet having excellent heat conductivity, a highly thermally-conductive adhesive sheet with a metal foil, a highly thermally-conductive adhesive sheet with a metal plate and a metal-based printed circuit board and a power module capable of suppressing internal temperature rise in operation. PSOLUTION: The present invention provides a polymer composition containing aggregate particles formed by boron nitride and a polymer component, wherein the aggregate particles have ≥500 MPa hardness according to the nanoindentation method. PCOPYRIGHT: (C)2009,JPO&INPIT
机译:

要解决的问题:为了提供能够改善成型品的导热性的聚合物组合物,具有优异的导热性的导热片,具有金属箔的高导热性粘合片,高导热性粘合剂具有金属板的板和金属基印刷电路板以及能够抑制内部温度上升的功率模块。 <解决方案>本发明提供了一种聚合物组合物,其包含由氮化硼形成的聚集颗粒和聚合物组分,其中根据纳米压痕方法,该聚集颗粒具有≥500MPa的硬度。

版权:(C)2009,日本特许厅&INPIT

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