首页> 外国专利> RESIN COMPOSITION, HEAT CONDUCTIVE SHEET, HIGHLY HEAT CONDUCTIVE ADHESIVE SHEET WITH METAL FOIL AND HIGHLY HEAT CONDUCTIVE ADHESIVE SHEET WITH METAL PLATE

RESIN COMPOSITION, HEAT CONDUCTIVE SHEET, HIGHLY HEAT CONDUCTIVE ADHESIVE SHEET WITH METAL FOIL AND HIGHLY HEAT CONDUCTIVE ADHESIVE SHEET WITH METAL PLATE

机译:树脂成分,导热板,带金属箔的高导热胶板和带金属板的高导热胶板

摘要

PROBLEM TO BE SOLVED: To provide a resin composition having excellent heat-curability, to provide a heat conductive sheet and a highly heat conductive adhesive sheet with a metal foil having excellent heat conductivity, heat resistance, etc., and good adhesion operation efficiency and to provide a highly heat conductive adhesive sheet with a metal plate, etc.;SOLUTION: The resin composition comprises an epoxy resin and an inorganic filler and further contains a curing accelerator so as to heat-cure the epoxy resin. In the resin composition, an inorganic filler containing a boron trioxide component is used as the inorganic filler. A boron trifluoride-based curing accelerator is used as the curing accelerator.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供具有优异的热固化性的树脂组合物,提供具有金属箔的导热性片和高导热性粘合片,所述金属箔具有优异的导热性,耐热性等,并且粘合操作效率和;以提供具有金属板等的高导热性粘合片;解决方案:树脂组合物包含环氧树脂和无机填料,并进一步包含固化促进剂以对环氧树脂进行热固化。在树脂组合物中,使用含有三氧化硼成分的无机填料作为无机填料。以三氟化硼为基础的固化促进剂。;版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP2008088406A

    专利类型

  • 公开/公告日2008-04-17

    原文格式PDF

  • 申请/专利权人 NITTO SHINKO KK;

    申请/专利号JP20070172590

  • 发明设计人 UTSUNOMIYA NAOKI;YONEMURA HIROYUKI;

    申请日2007-06-29

  • 分类号C08L63/00;C09J7/02;C09J7/00;C09J11/04;C09J163/00;C09J11/06;C08K3/38;C08G59/72;B32B15/092;H01L23/373;

  • 国家 JP

  • 入库时间 2022-08-21 20:24:01

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