WAFER LEVEL RELIABILITY EVALUATION ELEMENT AND WAFER LEVEL RELIABILITY EVALUATION DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wafer level reliability evaluation element capable of maintaining the inside of an evaluation element in uniform and accurate temperature conditions in a short time.;SOLUTION: The wafer level reliability evaluation element comprises: a reliability evaluation target element 1; a plurality of electrode pads 3a to 3d which are electrically connected to the reliability evaluation target element 1; a plurality of heating elements 2a to 2f which are provided in the circumference of the reliability evaluation target element 1; and a pair of electrode pads 5 for heating elements. The heating elements 2a to 2f are made of a positive temperature coefficient (PTC) material. The pair of electrode pads 5 for heating elements is electrically connected in parallel to the heating elements 2a to 2f.;COPYRIGHT: (C)2012,JPO&INPIT