WAFER HOLDING BODY FOR WAFER PROBER AND THE WAFER PROBER EQUIPPED WITH THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wafer holding body which realizes temperature distribution with high accuracy, maintains the flatness of a chuck top while preventing deformation and damage of the chuck top during rapid heating up and cooling down or pressing in probing, and enables highly accurate measurements even after being used repeatedly, and to provide a wafer prober apparatus equipped with the wafer holding body.;SOLUTION: A wafer holding body for a wafer prober 1 includes a chuck top 2 having a chuck top conductor layer 3 on its surface and including a heating body 4; multiple supporting bars 5 supporting the chuck top 2; and a bottom part substrate 6 on which the supporting bars 5 are installed. The supporting bars 5 partially support a rear surface of the chuck top 2. Further, it is preferable that a total chuck top supporting area of the supporting bars 5 is less than 15 percent of the entire area of the rear surface of the chuck top 2. The chuck top 2 can include a cooling module.;COPYRIGHT: (C)2013,JPO&INPIT