首页> 外国专利> Is formed on the other circuit components on the integrated circuit chip microfabricated transducer and manufacturing method thereof

Is formed on the other circuit components on the integrated circuit chip microfabricated transducer and manufacturing method thereof

机译:在集成电路芯片微细换能器上的其他电路部件上形成的方法及其制造方法

摘要

(57) Abstract This invention here array of acoustic transducer to be included, as for array of acoustic transducer be able to offer the array and the production method of acoustic transducer or this kind of transducer which is formed on one integrated circuit tip/chip, be able to detect the respective sound signaling and be able to generate the transducer signal, the 1st and 2nd electrode where the void territory is arranged between and, one which the 1st and 2nd electrode is related on the one hand signal line is included at least. Under array of acoustic transducer the plural amplifiers and the other circuit components are arranged, therefore the respective plural amplifiers are connected by one of the signal lines which it is related to one of acoustic transducer, in order to obtain the transducer signal which is expanded on the output signal line of the amplifier the transducer signal which it is related can be expanded.
机译:(57)<摘要>这里将包括本发明的声换能器阵列,至于声换能器阵列能够提供形成在一个集成电路尖端/上的声换能器或这种换能器的阵列和生产方法/芯片,能够检测相应的声音信号并能够产生换能器信号,在其间设置有空隙区域的第一和第二电极,以及一方面与第一和第二电极相关的一个电极至少。在声换能器的阵列下方布置有多个放大器和其他电路组件,因此,通过与声换能器之一相关的信号线之一连接相应的多个放大器,以便获得在其上扩展的换能器信号。放大器的输出信号线可以扩展与之相关的换能器信号。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号