首页> 外国专利> Microfabricated transducers formed over other circuit components on an integrated circuit chip and methods for making the same

Microfabricated transducers formed over other circuit components on an integrated circuit chip and methods for making the same

机译:在集成电路芯片上的其他电路组件之上形成的超微型换能器及其制造方法

摘要

The present invention provides an acoustic transducer, or an array of such transducers, formed on a single integrated circuit chip, and a method of making the same, in which there is included an array of acoustic transducers, each capable of detecting an acoustic signal and generating a transducer signal, and including a first and second electrode with a void region disposed between the first and second electrode, and at least one signal line associated with one of the first and second electrodes. Disposed below the array of acoustic transducers is a plurality of amplifiers and other circuit components, such that each of the plurality of amplifiers is coupled to one of the signal lines associated with one of the acoustic transducers and is capable of amplifying the associated transducer signal to obtain an amplified transducer signal on an amplifier output signal line.
机译:本发明提供了形成在单个集成电路芯片上的声换能器或这种换能器的阵列及其制造方法,其中包括声换能器的阵列,每个声换能器能够检测声信号并检测声信号。产生换能器信号,并且包括第一电极和第二电极,在第一电极和第二电极之间设置有空隙区域,以及至少一条与第一电极和第二电极之一相关的信号线。多个放大器和其他电路组件布置在声换能器阵列的下方,使得多个放大器中的每个耦合到与声换能器之一相关联的信号线之一,并且能够将相关联的换能器信号放大到在放大器输出信号线上获得放大的换能器信号。

著录项

  • 公开/公告号US6562650B2

    专利类型

  • 公开/公告日2003-05-13

    原文格式PDF

  • 申请/专利权人 SENSANT CORPORATION;

    申请/专利号US20010823412

  • 发明设计人 IGAL LADABAUM;

    申请日2001-03-29

  • 分类号H01L210/00;H01L410/40;H01L410/80;H01L411/80;

  • 国家 US

  • 入库时间 2022-08-22 00:07:40

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