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Microfabricated transducers formed over other circuit components on an integrated circuit chip and methods for making the same
Microfabricated transducers formed over other circuit components on an integrated circuit chip and methods for making the same
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机译:在集成电路芯片上的其他电路组件之上形成的超微型换能器及其制造方法
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摘要
The present invention provides an acoustic transducer, or an array of such transducers, formed on a single integrated circuit chip, and a method of making the same, in which there is included an array of acoustic transducers, each capable of detecting an acoustic signal and generating a transducer signal, and including a first and second electrode with a void region disposed between the first and second electrode, and at least one signal line associated with one of the first and second electrodes. Disposed below the array of acoustic transducers is a plurality of amplifiers and other circuit components, such that each of the plurality of amplifiers is coupled to one of the signal lines associated with one of the acoustic transducers and is capable of amplifying the associated transducer signal to obtain an amplified transducer signal on an amplifier output signal line.
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