首页> 外国专利> Semiconductor memory device, a semiconductor manufacturing method of a storage device, the reading method of a semiconductor memory device writing method and a semiconductor memory device

Semiconductor memory device, a semiconductor manufacturing method of a storage device, the reading method of a semiconductor memory device writing method and a semiconductor memory device

机译:半导体存储装置,存储装置的半导体制造方法,半导体存储装置的读取方法以及半导体存储装置

摘要

It is a simple construction (issues) the memory cell, is to provide a semiconductor memory device which realizes a high density of memory cells. The drain 18 of the selection transistor 14 (SOLUTION) memory cell 10 is connected to an electrode 12c on one side of the resistance memory element 12, the word line WL, the first group of memory cells disposed along the word line WL is connected to the electrode 12a of the other of the resistive memory element of the plurality is connected to the gate G of the select transistor 14 contained multiple, contained in the memory cell group of the first bit line BL is the bit line It is connected to the source 16 of the selection transistor 14 contained multiple group of memory cells disposed second along the BL. [Selection Figure Figure 2
机译:这是一种简单的构造(发出)存储单元的方法,目的是提供一种实现高密度存储单元的半导体存储器件。选择晶体管14(SOLUTION)存储单元10的漏极18连接到电阻存储元件12的一侧上的电极12c,字线WL,沿着字线WL设置的第一组存储单元连接到多个电阻存储元件中的另一个的电极12a连接到包含多个的选择晶体管14的栅极G,包含在第一位线BL的存储单元组中的是位线,它连接到源极选择晶体管14的图16中包含沿着BL排列第二的多组存储单元。 [选择图图2

著录项

  • 公开/公告号JP5062176B2

    专利类型

  • 公开/公告日2012-10-31

    原文格式PDF

  • 申请/专利权人 富士通株式会社;

    申请/专利号JP20080535249

  • 发明设计人 木下 健太郎;

    申请日2006-09-22

  • 分类号H01L27/105;H01L45/00;H01L49/00;G11C13/00;

  • 国家 JP

  • 入库时间 2022-08-21 17:39:48

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号