Method for forming a rolled copper foil or an electrolytic copper foil and an electronic circuit using these electronics

摘要

Epitome The rolling copper foil or the electrolytic copper foil for the electronic circuit which features that the heatproof formation which consists of nickel or nickel alloy formation, and the said nickel or were formed on nickel alloy formation spelter or the spelter alloy or these oxides whose etching rate is lower than the copper which was formed to the etching surface side of the said rolling copper foil or the electrolytic copper foil in the rolling copper foil or the electrolytic copper foil for the electronic circuit which does circuit formation with etching, is had. The copper foil of the copper-clad laminate with etching circuit formation is done at the time of, be able to prevent the sagging due to etching, be able to form the uniform circuit of the circuit width which is made purpose, as time of the circuit formation with etching is compacted if possible, making the thickness of nickel or nickel alloy formation to the utmost thin, furthermore oxidation is suppressed when heat is received, as the discoloration which is called alias yake is prevented, at the same time improvement of etching Characteristic in pattern etching, it designates that the defective generation of short circuit and circuit width is prevented as topic.