ROLLED COPPER FOIL OR ELECTROLYTIC COPPER FOIL FOR ELECTRONIC CIRCUIT, METHOD FOR FORMING ELECTRONIC CIRCUIT AND PRINTED SUBSTRATE USING THE ROLLED COPPER FOIL OR ELECTROLYTIC COPPER FOIL

摘要

In the electrolytic copper foil or rolled copper foil for electronic circuit forming the circuit by etching, the rolled copper foil or Electrolytic etching rate is lower than the nickel or nickel alloy layer formed on the etched surface side of the copper foil, and a nickel or nickel characterized in that the electron and a heat-resistant layer made of zinc or a zinc alloy or a oxide layer formed on the alloy rolled copper foil or electrolytic copper foil for a circuit. When forming a circuit by etching the copper foil of the copper-clad laminate, to prevent sagging due to etching, the circuit width of interest may form a uniform circuit, with the circuit formed by the etching time and possible shortening Sikkim , nickel or nickel as possible to thin the thickness of the alloy layer, to inhibit oxidation when receiving the column also, known as "yellowing", the with the called prevents discoloration, and improvement of etching in the pattern etching polarity, short-circuit or and to prevent the occurrence of the defect of the width to the problem. ;