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METHOD OF MANUFACTURING OXIDE SEMICONDUCTOR THIN FILM, OXIDE SEMICONDUCTOR THIN FILM, METHOD OF MANUFACTURING THIN FILM TRANSISTOR, THIN FILM TRANSISTOR, AND DEVICE HAVING THIN FILM TRANSISTOR
METHOD OF MANUFACTURING OXIDE SEMICONDUCTOR THIN FILM, OXIDE SEMICONDUCTOR THIN FILM, METHOD OF MANUFACTURING THIN FILM TRANSISTOR, THIN FILM TRANSISTOR, AND DEVICE HAVING THIN FILM TRANSISTOR
PROBLEM TO BE SOLVED: To manufacture an IGZO-system oxide thin film having a high reproducibility and suitable for producing a large area device, especially a flexible device, without heat treatment at a high temperature of 300°C or higher.;SOLUTION: An oxide semiconductor thin film in which In, Ga, Zn, and O are used as main constituent elements, and in which a composition ratio satisfies relationships of 11/20≤Ga/(In+Ga+Zn)≤9/10, 3/4≤Ga/(In+Ga)≤9/10, and Zn/(In+Ga+Zn)≤1/3, is formed in an argon gas atmosphere by the sputtering method without introducing an oxygen gas. Heat treatment at equal to or higher than 100°C and lower than 300°C is performed in an oxidative atmosphere to the formed oxide semiconductor thin film.;COPYRIGHT: (C)2012,JPO&INPIT
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机译:解决的问题:制造具有高再现性并且适用于生产大面积器件,尤其是柔性器件且无需在300°C或更高的高温下进行热处理的IGZO系统氧化物薄膜;解决方案:其中In,Ga,Zn和O为主要构成元素并且组成比满足11 /20≤Ga/(In + Ga + Zn)≤9/ 10、3 /的关系的氧化物半导体薄膜在不引入氧气的情况下,通过溅射法在氩气气氛中形成4≤Ga/(In + Ga)≤9/ 10,并且Zn /(In + Ga + Zn)≤1/ 3。在氧化气氛中对形成的氧化物半导体薄膜进行等于或高于100°C且低于300°C的热处理。; COPYRIGHT:(C)2012,JPO&INPIT
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