PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of uniformly controlling the width of a removing portion on the peripheral edge of a film to be processed which is formed on a substrate over the entire periphery of the substrate.;SOLUTION: The substrate processing apparatus is configured so as to be provided with: a liquid film forming section equipped with an opposite surface portion opposite via a gap to the peripheral edge portion of the rear surface side of the substrate held by a substrate holding section, forming a liquid film in the gap by surface tension and allowing the liquid film to sneak into the front surface from the rear surface of the substrate by a centrifugal force of the substrate to remove the peripheral edge portion of the film to be processed; and a posture control section in which a gas jetting hole and a gas suction hole are provided so as to oppose the rear surface of the substrate closer to the center than the opposite surface portion. Vertical wobbling of the substrate can be prevented by the gas jetting and suction actions, and the height of the peripheral edge portion of the substrate is adjusted depending on the gas jetting amount and suction amount to control the position of sneaking liquid film on the front surface side of the substrate, and the width to be removed of the film to be processed is controlled.;COPYRIGHT: (C)2010,JPO&INPIT
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