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The thermal conductivity filler and the thermoplasticity constituent which includes super branching polyester amide

机译:包括超支化聚酯酰胺的导热填料和热塑性成分

摘要

The thermal conductivity filler where it is equal to the 100 , or is equal to glass transfer and the 280 which exceed that at least the semi- aromatic polyamide of 1 where it possesses the melting point which exceeds that genera and, at least possesses the thermal conductivity of 5W/mK, for example, the thermoplasticity2 constituent which includes with the CaF powder and at least the super branching polyester amide of 1 where it possesses the terminal hydroxy basis genera, and the formation goods which then are produced are disclosed.
机译:等于或大于100或等于玻璃传递和280的导热填料,其导热系数大于至少1的半芳族聚酰胺,其熔点超过该属并且至少具有导热系数电导率为5W / mK,例如,具有CaF粉末和至少具有1个超支化聚酯酰胺的热塑性 2 成分,其中所述超级支化聚酯酰胺具有末端羟基基属,并且其形成物为然后生产被披露。

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