首页>
外国专利>
Adhesive composition for semiconductor device, adhesive sheet for semiconductor device using the same, substrate for connecting semiconductor device, and semiconductor device
Adhesive composition for semiconductor device, adhesive sheet for semiconductor device using the same, substrate for connecting semiconductor device, and semiconductor device
PPROBLEM TO BE SOLVED: To provide a new adhesive composition for semiconductor devices excellent in adhesive durability, an adhesive sheet for semiconductor devices using the same, a substrate for connecting semiconductor devices and semiconductor devices. PSOLUTION: The adhesive composition for semiconductor devices comprises a 3 functional thermoplastic resin (A) having at least one functional group selected from a group consisting of epoxy, hydroxy, carboxy, amino, silanol, isocyanate, phenolic hydroxy, vinyl, maleimide and mercapto, an alicyclic epoxy resin (B) and a curing agent (C) for the epoxy resin. PCOPYRIGHT: (C)2007,JPO&INPIT
展开▼