A semiconductor device using the positive photosensitive resin composition, cured film, protective film, insulating film, the display device body.

摘要

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition using a polybenzoxazole precursor having moderate solubility in a nitrogen-free solvent, and hardly causing scum in development (resin residue after development).;SOLUTION: The positive photosensitive resin composition comprises the polybenzoxazole precursor (A) obtained by polymerizing 3,3-diamino-4,4-dihydroxydiphenyl ether as bisaminophenol and isophthalic acid or isophthalic acid and 4,4-dicarboxydiphenyl ether as dicarboxylic acid and a photosensitizing agent (B).;COPYRIGHT: (C)2008,JPO&INPIT