Electronic apparatus having a mounting structure of a high-frequency circuit chip

摘要

PPROBLEM TO BE SOLVED: To suppress leakage of high frequency wave in the vicinity of joint of a signal line at the time of packaging a high frequency circuit chip. PSOLUTION: A chip having two microstrip waveguides formed therein as shown in Fig. 3.A is mounted on a dielectric substrate having four ports wherein port 1 is connected with port 2, and port 3 is connected with port 4. In Fig. 3.B where the joint of the port 1 to the substrate and the chip is enlarged, a bonding wire 30L connects a signal line (substrate surface layer line) 27L provided on a dielectric film 2Lc with a wire bonding portion at the left end of a microstrip conductor (chip signal line) 17. Bonding wires 30Lg1 and 30Lg2 connect exposed part at two position of an upper ground substrate on the substrate side (substrate surface layer ground layer) 26L with a bonding pad connected with a ground layer on the chip side (chip ground layer) 15. PCOPYRIGHT: (C)2008,JPO&INPIT