首页> 外国专利> HIGH-FREQUENCY ELECTRONIC CIRCUIT AND STRUCTURE OF MOUNTING CHIP THREE-TERMINAL CAPACITOR ON THE SAME

HIGH-FREQUENCY ELECTRONIC CIRCUIT AND STRUCTURE OF MOUNTING CHIP THREE-TERMINAL CAPACITOR ON THE SAME

机译:高频电子电路和在其上安装芯片三端子电容器的结构

摘要

PROBLEM TO BE SOLVED: To provide a high-frequency electronic circuit where a bypass capacitor is capable of displaying enough its function.;SOLUTION: A wiring board 11 or a package is equipped with an earth line grounding layer 7 arranged inside or on the rear of a board, a power supply line circuit layer 8 arranged on the surface of the board, and a relay land electrode layer 10 connected to the earth line grounding layer 7 through the intermediary of a through-hole or a viahole 9, a chip three-terminal capacitor 6 equipped with input/output terminals 6b and 6c and a grounding terminal 6d is surface-mounted on the wiring board 11 or the package, the input/output terminals 6b and 6c are connected to the power supply line circuit layer 8, and the grounding terminal 6d is connected to the relay land electrode layer 10, by which the chip three-terminal capacitor 6 is made to function as a bypass capacitor. The length of the through-hole or the viahole 9 is set at 0.5 mm or below, by which the bypass capacitor is lessened in total residual inductance.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:提供一种高频电子电路,其中旁路电容器能够充分发挥其功能。解决方案:接线板11或封装的内部或背面均配有接地线接地层7。基板,设置在基板表面上的电源线电路层8,以及通过通孔或通孔9,芯片3的中间部分连接到接地线接地层7的继电器接地电极层10在配线基板11或封装上表面安装有具备输入输出端子6b,6c和接地端子6d的端子电容器6,输入输出端子6b,6c与电源线电路层8连接。接地端子6d与中继焊盘电极层10连接,由此使芯片三端子电容器6作为旁路电容器发挥作用。通孔或通孔9的长度设置为0.5 mm或更小,从而减少了旁路电容器的总残留电感。COPYRIGHT:(C)2001,JPO

著录项

  • 公开/公告号JP2001015885A

    专利类型

  • 公开/公告日2001-01-19

    原文格式PDF

  • 申请/专利权人 MURATA MFG CO LTD;

    申请/专利号JP19990188794

  • 申请日1999-07-02

  • 分类号H05K1/18;H03H7/01;H05K1/02;H05K1/11;

  • 国家 JP

  • 入库时间 2022-08-22 01:31:16

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