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HIGH-FREQUENCY ELECTRONIC CIRCUIT AND STRUCTURE OF MOUNTING CHIP THREE-TERMINAL CAPACITOR ON THE SAME
HIGH-FREQUENCY ELECTRONIC CIRCUIT AND STRUCTURE OF MOUNTING CHIP THREE-TERMINAL CAPACITOR ON THE SAME
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机译:高频电子电路和在其上安装芯片三端子电容器的结构
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摘要
PROBLEM TO BE SOLVED: To provide a high-frequency electronic circuit where a bypass capacitor is capable of displaying enough its function.;SOLUTION: A wiring board 11 or a package is equipped with an earth line grounding layer 7 arranged inside or on the rear of a board, a power supply line circuit layer 8 arranged on the surface of the board, and a relay land electrode layer 10 connected to the earth line grounding layer 7 through the intermediary of a through-hole or a viahole 9, a chip three-terminal capacitor 6 equipped with input/output terminals 6b and 6c and a grounding terminal 6d is surface-mounted on the wiring board 11 or the package, the input/output terminals 6b and 6c are connected to the power supply line circuit layer 8, and the grounding terminal 6d is connected to the relay land electrode layer 10, by which the chip three-terminal capacitor 6 is made to function as a bypass capacitor. The length of the through-hole or the viahole 9 is set at 0.5 mm or below, by which the bypass capacitor is lessened in total residual inductance.;COPYRIGHT: (C)2001,JPO
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