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HIGH FREQUENCY ELECTRONIC CIRCUIT AND STRUCTURE FOR MOUNTING CHIP-TYPE THREE-TERMINAL CAPACITOR ONTO HIGH FREQUENCY ELECTRONIC CIRCUIT
HIGH FREQUENCY ELECTRONIC CIRCUIT AND STRUCTURE FOR MOUNTING CHIP-TYPE THREE-TERMINAL CAPACITOR ONTO HIGH FREQUENCY ELECTRONIC CIRCUIT
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机译:高频电子电路及在高频电子电路上安装芯片型三端电容器的结构
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摘要
PROBLEM TO BE SOLVED: To provide a high frequency electronic circuit for which mounting space can be reduced and with which noise rejection effects can surely be obtained when an electronic part has a large number of power terminals.;SOLUTION: The circuit has a plurality of power layers 4, 6, 8 which are formed on an upper surface of or inside a mount board 2, a common ground layer 3 which is formed on a plane of the mount board 2 different from the power layers 4, 6, 8, a power line 9 which is disposed outside the mount board 2, and an IC 12 as an electronic part to which power is supplied from the power layers 4, 6, 8. The chip-type three-terminal capacitors 21, 21A-21C, 24-28 are mounted on the upper surface of the mount board 2. An input electrode and an output electrode of each of the chip-type three-terminal capacitors are electrically connected to the power layers 4, 6 or the power layers 6, 8, so as to be inserted into a power supply channel constituted of the power layers 4, 6, 8 and the power line 9. The mounting structure of three-terminal capacitor is characterised in that a ground electrode of each three-terminal capacitor is electrically connected to the common ground layer 3.;COPYRIGHT: (C)2005,JPO&NCIPI
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