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DEEP TRENCH CAPACITOR WITH CONFORMALLY-DEPOSITED CONDUCTIVE LAYERS HAVING COMPRESSIVE STRESS
DEEP TRENCH CAPACITOR WITH CONFORMALLY-DEPOSITED CONDUCTIVE LAYERS HAVING COMPRESSIVE STRESS
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机译:深沟槽电容器,具有压缩应力的共形沉积导电层
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摘要
A high density deep trench MIM capacitor structure is provided wherein conductive-compressive-conformally applied layers of a semiconductor material, such as a Poly-SixGe1-x, are interleaved within MIM capacitor layers to counterbalance the tensile stresses created by such MIM capacitor layers. The interleaving of conductive-compressive-conformally applied material layers are adapted to counterbalance convex (upward) bowing of silicon wafers during the manufacturing process of high density deep trench MIM capacitor silicon devices to thereby help maximize production yields of such devices per wafer.
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机译:提供了一种高密度深沟槽MIM电容器结构,其中,半导体材料例如Poly-Si x Sub> Ge 1-x Sub>的导电-压缩-共形施加的层是在MIM电容器层中交错排列以平衡由此类MIM电容器层产生的拉应力。导电-压缩-共形施加的材料层的交织适合于在高密度深沟槽MIM电容器硅器件的制造过程中平衡硅晶片的凸(向上)弯曲,从而帮助使每个晶片的这种器件的生产率最大化。
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