MULTI-DIE PACKAGES INCORPORATING FLIP CHIP DIES AND ASSOCIATED PACKAGING METHODS

摘要

The present technology discloses a multi-die package. The package comprises a lead frame structure and three dies including a first flip chip die, a second flip chip die and a third flip chip die stacked vertically. The first flip chip die is mounted on the bottom surface of the lead frame structure through the flip chip bumps; the second flip chip is mounted on the top surface of the first flip chip die through flip chip bumps; and the third flip chip die is mounted on the top surface of the lead frame structure through flip chip bumps.