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Method of enhancing dopant activation without suffering additional dopant diffusion

机译:增强掺杂剂活化而不会造成额外掺杂剂扩散的方法

摘要

A method of enhancing dopant activation without suffering additional dopant diffusion, includes forming shallow and lightly-doped source/drain extension regions in a semiconductor substrate, performing a first anneal process on the source/drain extension regions, forming deep and heavily-doped source/drain regions in the substrate adjacent to the source/drain extension regions, and performing a second anneal process on source/drain regions. The first anneal process is a flash anneal process performed for a time of between about 1 millisecond and 3 milliseconds, and the second anneal process is a rapid thermal anneal process performed for a time of between about 1 second and 30 seconds.
机译:一种增强掺杂剂激活而不遭受额外掺杂剂扩散的方法,包括在半导体衬底中形成浅掺杂和轻掺杂的源极/漏极扩展区,在源极/漏极扩展区上执行第一退火工艺,形成深重掺杂的源极/漏极。衬底中的与源极/漏极延伸区相邻的漏极区,并在源极/漏极区上执行第二退火工艺。第一退火过程是执行约1毫秒至3毫秒之间的时间的快速退火过程,而第二退火过程是执行约1秒至30秒之间的时间的快速热退火过程。

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