Techniques are generally disclosed for controlling a release event from an electrical component. In some examples described herein, a device may include an inner packing material that is coupled to the electrical component and adapted to surround the electrical component. The inner packing material may be configured to trap gases produced by the electrical component during a release event. Additional examples described herein may include outer packing material configured to contain the inner packing material and substantially maintain a rigid shape during the release event. Further examples may include connection rods between the inner packing material and the outer packing material, wherein the connection rods are configured to resist expansion of the inner packing material. In some examples described herein, the inner packing material may be sealed to prevent a release of gas created by the release event.
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