METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT WITH A LOW COST LEADFRAME USING A NON-METALLIC BASE STRUCTURE

摘要

A METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT (10) THAT INCLUDES A LEADFRAME HAVING A NON-METALLIC BASE STRUCTURE (12) AND AN INTERMEDIATE LEADFRAME STRUCTURE. THE NON-METALLIC BASE STRUCTURE (12) MAY BE, AMONG OTHER THINGS, PAPER, CELLULOSE, OR PLASTIC. A LAYER OF ELECTRICALLY CONDUCTIVE MATERIAL IS FORMED OVER THE NON-METALLIC BASE STRUCTURE (12). A CIRCUIT ELEMENT ATTACH STRUCTURE AND A PLURALITY OF LEADFRAME LEADS ARE FORMED FROM THE LAYER OF ELECTRICALLY CONDUCTIVE MATERIAL. A CIRCUIT ELEMENT IS COUPLED TO THE CIRCUIT ELEMENT ATTACH STRUCTURE AND ELECTRICALLY COUPLED TO THE PLURALITY OF LEADFRAME LEADS. THE CIRCUIT ELEMENT IS ENCAPSULATED AND AT LEAST THE NON-METALLIC BASE STRUCTURE (12) IS REMOVED. ALTERNATIVELY, A PLURALITY OF LEADFRAME LEADS MAY BE FORMED ON THE ELECTRICALLY CONDUCTIVE LAYER AND A CIRCUIT ELEMENT IS PLACED OVER THE ELECTRICALLY CONDUCTIVE LAYER. THE CIRCUIT ELEMENT IS ELECTRICALLY COUPLED TO THE PLURALITY OF LEADFRAME LEADS AND ENCAPSULATED. THE NON-METALLIC BASE STRUCTURE (12) AND THE ELECTRICALLY CONDUCTIVE LAYER ARE REMOVED.