首页> 外国专利> PROCESS FOR PREPARING, PRIOR TO FILLING, A WAFER CORNET, CORNET THUS OBTAINED AND INSTALLATION FOR IMPLEMENTING THE PROCESS

PROCESS FOR PREPARING, PRIOR TO FILLING, A WAFER CORNET, CORNET THUS OBTAINED AND INSTALLATION FOR IMPLEMENTING THE PROCESS

机译:在填充之前准备晶片短号的过程,已获得短号,并安装了用于实施该过程的小短号

摘要

Process for preparing a cornet consisting of a substantially conical wafer(22) prior to the filling of said cornet with an ice-cream; in order topreserve the crunchy nature of the wafer, the inner wall of the cornet issprayed with liquid chocolate (23); this chocolate solidifies rapidly in orderto form a coating layer for separating the wafer and the ice-cream. Theprocess is characterized in that the inside of the cornet is sprayed with anexcess quantity of chocolate to guarantee that no coating-gap zone remains onthe inner wall of the wafer, the excess liquid chocolate collecting, undergravity, at the bottom tip of the corner; prior to solidification of saidexcess, the excess is sucked out of the cornet, subsequent solidification ofthe coating layer thus making it possible to establish a continuous barrierover the inner wall of the wafer.
机译:制备由基本上圆锥形的晶片组成的短号的方法(22)在用冰淇淋填充所述短号之前;为了保持威化饼的脆性,短号的内壁是喷上液态巧克力(23);这种巧克力可以快速凝固形成用于分离晶片和冰淇淋的涂层。的该方法的特征在于短号的内部喷有过量的巧克力,以确保没有涂层间隙区域残留薄饼的内壁上,多余的液态巧克力收集在重力,位于角落的底部;在凝固之前说多余的,多余的被从短号中吸出,随后凝固涂层因此可以建立连续的屏障在晶片的内壁上。

著录项

  • 公开/公告号CA2562382C

    专利类型

  • 公开/公告日2012-07-03

    原文格式PDF

  • 申请/专利权人 NESTEC S.A.;

    申请/专利号CA20052562382

  • 申请日2005-02-14

  • 分类号A21C15;A23G9/28;

  • 国家 CA

  • 入库时间 2022-08-21 17:20:46

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