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BONDING COMPOSITION FOR A ROTARY TARGET FOR SPUTTERING AND BONDING METHOD OF A ROTARY TARGET USING SAME
BONDING COMPOSITION FOR A ROTARY TARGET FOR SPUTTERING AND BONDING METHOD OF A ROTARY TARGET USING SAME
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机译:用于旋转目标的旋转目标的键合组成和使用相同目标的旋转目标的键合方法
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摘要
The present invention relates to a bonding composition for a rotary target for a sputtering and bonding method of a rotary target using the same. According to the present invention, the bonding composition for a rotary target for sputtering bonds a cylindrical target to an outer peripheral surface of a cylindrical backing tube of the rotary target for sputtering, wherein the rotary target is rotatably installed in a chamber for sputtering to apply high voltage while being rotated by a driving motor, wherein the bonding composition for sputtering, for bonding the target to the outer peripheral surface of the backing tube comprises a mixture of 50 to 54 wt% of Bismuth and 46 to 50 wt% of tin (Sn). In addition, provided is a method for bonding a rotary target for sputtering, using the bonding composition for a rotary target. According to the present invention, production cost for a rotary target for sputtering is significantly reduced.
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