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METHOD FOR BONDING ROTARY TARGET ASSEMBLY FOR SPUTTERING AND ROTARY TARGET ASSEMBLY FOR SPUTTERING MANUFACTURED BY BONDING METHOD
METHOD FOR BONDING ROTARY TARGET ASSEMBLY FOR SPUTTERING AND ROTARY TARGET ASSEMBLY FOR SPUTTERING MANUFACTURED BY BONDING METHOD
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机译:结合方法制造的溅射靶材的结合方法和制造方法的溅射靶材的结合方法
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摘要
The present invention relates to a method for bonding a rotary target assembly for sputtering and a rotary target assembly for sputtering manufactured by the bonding method. When bonding a sputtering target on an outer circumferential surface of a backing tube, the sputtering target can be bonded through injecting elastomer, thereby enabling a low-temperature combination. To achieve this, according to the present invention, a method for bonding a sputtering target on an outer circumferential surface of a backing tube comprises steps of: (a) normally positioning a backing tube on a surface plate to a longitudinal direction; (b) fixedly coupling a target support pipe on an outer circumferential surface of a lower end portion of the backing tube; (c) normally positioning a gap between an outer circumferential surface of the backing tube and an inner circumferential surface of the sputtering target to be uniform; (d) injecting liquid elastomer a gap between the backing tube and the sputtering target; and (e) bonding the sputtering target on an outer circumference of the backing tube.;COPYRIGHT KIPO 2015
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