首页> 外国专利> BONDING COMPOSITION COMPOSED OF TWO ORE MORE INEXPENSIVE METALS FOR A ROTARY SPUTTERING TARGET AND A ROTARY TARGET BONDING METHOD USING THE SAME

BONDING COMPOSITION COMPOSED OF TWO ORE MORE INEXPENSIVE METALS FOR A ROTARY SPUTTERING TARGET AND A ROTARY TARGET BONDING METHOD USING THE SAME

机译:旋转溅射靶材中两种或两种以上低价金属的键合组成及使用相同方法的旋转靶材键合方法

摘要

PURPOSE: A bonding composition for a rotary sputtering target and a rotary target bonding method using the same are provided to manufacture a rotary target at low cost by mixing two or more inexpensive metals.;CONSTITUTION: A bonding composition for a rotary sputtering target bonds a cylindrical target(120) to the outer periphery of a cylindrical backing tube(110) of a rotary sputtering target. The bonding composition comprises bismuth of 50-54wt.%, Sn(Stannum) of 46-50wt.%, and In(Indium) or Ag(Silver) of 1-6wt.%.;COPYRIGHT KIPO 2012
机译:目的:提供一种用于旋转溅射靶的粘合组合物和使用该组合物的旋转靶粘合方法,以通过混合两种或更多种便宜的金属以低成本制造旋转靶。圆筒形靶材(120)到旋转溅射靶的圆筒形背衬管(110)的外周。粘结组合物包含50-54wt。%的铋,46-50wt。%的Sn(锡)和1-6wt。%的In(铟)或Ag(银).; COPYRIGHT KIPO 2012

著录项

  • 公开/公告号KR20120055979A

    专利类型

  • 公开/公告日2012-06-01

    原文格式PDF

  • 申请/专利权人 PLANSEE SE;

    申请/专利号KR20100117463

  • 发明设计人 HAN SOON SEOK;WAYNE R SIMPSON;

    申请日2010-11-24

  • 分类号C23C14/34;B23K1/00;B23K35/26;

  • 国家 KR

  • 入库时间 2022-08-21 17:09:58

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