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Three-dimensional light-emitting diode structure with vertically displaced active region and method for fabricating the same

机译:具有垂直移位的有源区的三维发光二极管结构及其制造方法

摘要

A three-dimensional LED structure (1,2) with vertically displaced active-region (401,402) includes at least two groups of vertically displaced surfaces on a non-planar substrate. The first group of surfaces are separated from the second group of surfaces by a vertical distance in the growth direction of the LED structure. The first group of surfaces are connected to the second group of surfaces by sidewalls, respectively. The sidewalls can be inclined or vertical and have a sufficient height so that a layer such as an n-type layer (301), an active-region (401), or a p-type layer (501) in a first LED structure (1) deposited on the first group of surfaces and a corresponding layer such as an n-type layer (302), an active-region (402), or a p-type layer (502) in a second LED structure (2) deposited on the second group of surfaces are separated by the sidewalls. The two groups of surfaces may be vertically displaced from each other in certain areas (122,192) of an LED chip, while merge into an integral surface (102) in other areas. A method for fabricating the three-dimensional LED structure is also provided.
机译:具有垂直位移的有源区(401,402)的三维LED结构(1,2)包括在非平面基板上的至少两组垂直位移的表面。第一组表面与第二组表面在LED结构的生长方向上隔开垂直距离。第一组表面分别通过侧壁连接到第二组表面。侧壁可以是倾斜的或垂直的并且具有足够的高度,以使得第一LED结构(例如,n型层(301),有源区域(401)或p型层(501))的层( 1)沉积在第一组表面上,并沉积第二层LED结构(2)中的相应层,例如n型层(302),有源区域(402)或p型层(502)第二组表面上的侧壁被侧壁隔开。两组表面可以在LED芯片的某些区域(122,192)中彼此垂直地移位,而在其他区域中合并成整体表面(102)。还提供了一种用于制造三维LED结构的方法。

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