SOLDER RESIST, SOLDER RESIST STARTING MATERIAL, LED SUBSTRATE, LIGHT-EMITTING MODULE, APPARATUS HAVING LIGHT-EMITTING MODULE, METHOD FOR PRODUCING LED SUBSTRATE, METHOD FOR PRODUCING LIGHT-EMITTING MODULE, AND METHOD FOR PRODUCING APPARATUS HAVING LIGHT-EMITTING MODULE

摘要

This LED substrate is formed by forming a conductive layer (21) for mounting a light-emitting element on a substrate (10), providing a solder resist layer (11) on the substrate (10), and forming in the solder resist layer (11) an aperture for exposing the conductive layer (21). The solder resist layer (11) is configured from titanium oxide particles having an average particle diameter in the range of 0.1-10 μm and a silicone resin. The solder resist starting materials are configured from titanium oxide particles having an average particle diameter in the range of 0.1-10 μm and a silicone resin precursor composition.