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Method of producing ciruit board by additive method, and circuit board and multilayer circuit board obtained by the method
Method of producing ciruit board by additive method, and circuit board and multilayer circuit board obtained by the method
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机译:通过加成法制造电路板的方法,以及通过该方法获得的电路板和多层电路板
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摘要
The present invention relates to a method of producing a circuit board, comprising:a film-forming step of forming a resin film on the surface of an insulative substrate;a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the resin film on the external surface of the resin film;a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves on the insulative substrate and the surface of the resin film;a film-removing step of removing the resin film; anda plating processing step of electroless-plating the insulative substrate after removal of the resin film, whereina partial reinforcing structure is formed in a region of the circuit groove in the circuit groove-forming step.
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