首页> 外国专利> AN ELECTRONIC PRODUCT HAVING A DOUBLE-PCB SANDWICH STRUCTURE AND A METHOD OF ASSEMBLING THE SAME

AN ELECTRONIC PRODUCT HAVING A DOUBLE-PCB SANDWICH STRUCTURE AND A METHOD OF ASSEMBLING THE SAME

机译:具有双板夹层结构的电子产品及其组装方法

摘要

The invention provides an electronic product having a double-PCB sandwich structure, comprising a PCB assembly and a casing having an open side, wherein a protuberance is respectively formed on the inner sides of two side walls of the casing in the longitudinal direction, the PCB assembly consists of an electronic component, a base PCB and a main PCB, the length of the base PCB and the length of the main PCB in the longitudinal direction of the casing are substantially equal to each other and slightly smaller than the length of the casing so that the PCB assembly can be installed into the casing by mating with the protuberances.
机译:本发明提供一种具有双PCB夹层结构的电子产品,该电子产品包括PCB组件和具有开放侧的壳体,其中,在壳体的两个侧壁的沿纵向方向的内侧分别形成有突起。组件由电子元件,基础PCB和主PCB组成,在外壳的纵向上,基础PCB的长度和主PCB的长度基本上彼此相等,并且略小于外壳的长度以便可以通过与突起配合将PCB组件安装到外壳中。

著录项

  • 公开/公告号EP2471349A1

    专利类型

  • 公开/公告日2012-07-04

    原文格式PDF

  • 申请/专利权人 OSRAM AG;

    申请/专利号EP20100739888

  • 发明设计人 BRÜCKEL MARTIN;HE HAIXIANG;JIANG WANCHUN;

    申请日2010-07-29

  • 分类号H05K3/34;H01F27/02;H05K5/06;H05K1/14;

  • 国家 EP

  • 入库时间 2022-08-21 17:12:21

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